G1 Series Uncooled Thermal Module employs Infisense's self-developed ASIC infrared image processing chip, replacing the FPGA of traditional thermal imaging modules.
Rich and flexible interfaces, easy to integrate
Support DVP concurrent digital video output, SPI video transmission, and I2C and UART interfaces.
Support digital video formats such as RAW14, YUV, Y8, BT.656, BT.1120, and LVCMOS.
Support simultaneous output of image data + temperature data.
Integrate MCU internally and provide secondary development SDKs.
Small size, low power, and light weight
Benefiting from the compactness and high integration of ASIC, the module size is greatly reduced (26mm×26mm for the 384×288/640×512 module and 42mm×42mm for the 1024×768/1280×1024 module).
Benefiting from ASIC, the module power consumption is extremely low (384×288/640×512 module:<500mW, 1024×768/1280×1024 module: <1W).
The ASIC-based thermal module has only one circuit board, greatly reducing the weight (384×288/640×512 module:<18g, 1024×768/1280×1024: <75g).
Self-developed core
The core processor adopts Infisense's self-developed ASIC infrared processing chip, which is only 1/6 of the size and 1/3 of the power consumption of traditional FPGA, with a competitive price.
Equipped with industry-leading thermal image processing algorithm and temperature measurement algorithm, it can provide high-quality image and high-accuracy temperature measurement.
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Component Model |
G384 |
G384T |
G640 |
G640T |
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Detector |
Ceramic packaged uncooled VOx infrared detector |
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Pixel Size |
12μm |
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Spectral Band |
8~14μm |
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Resolution |
384×288 |
640×512 |
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Detector Frame Rate |
50Hz/25Hz |
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NETD |
≤50Hz@25°C, F#1.0 (≤40mK, optional) |
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TEC Temperature Control |
Not supported |
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Image Adjustment |
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Brightness Adjustment |
0~255, optional |
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Contrast Adjustment |
0~255, optional |
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Polarity |
Black-hot/White-hot |
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Palette |
Supported |
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Reticle |
Display/Blank/Move |
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Digital Zoom |
0.25×~2.0× continuous zoom |
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Mirroring |
Horizontal/Vertical/Diagonal |
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Image Processing |
TEC-less algorithm |
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Non-uniformity Correction |
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Digital filtering noise reduction |
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Digital detail enhancement |
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Module Power Supply |
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Service Voltage |
1.8V, 3.3V, 5V |
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Typical Power Consumption @ 25ºC |
<0.55W |
<0.6W |
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Module Interface |
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Digital Video |
DVP |
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Communication Interface |
I2C/UART |
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Physical Characteristics of Module (without lens) |
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Weight |
<18g |
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Dimensions |
26mm×26mm×19mm |
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Module Interface (module+expansion board) |
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Service Voltage |
4~6V, 5~12V |
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Power Protection |
Support overvoltage, undervoltage, and reverse connection protection |
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Video Output Interface |
PAL or NTSC, BT.656, LVCMOS |
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Support simultaneous output of all-array image + temperature data |
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Communication Interface |
I2C/RS232/UART |
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Button |
Four buttons |
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Temperature Measurement |
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Measurement Range |
Not supported |
High gain: -20°C~+150°C |
Not supported |
High gain: -20°C~+150°C |
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Low gain: 0°C~+550°C |
Low gain: 0°C~+550°C |
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Measurement Accuracy |
Not supported |
Ambient temperature (–20°C~+60°C): ±2°C or ±2% of the reading |
Not supported |
Ambient temperature (–20°C~+60°C): ±2°C or ±2% of the reading |
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Measurement Tool |
Not supported |
Point, line, and area analysis |
Not supported |
Point, line, and area analysis |
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Adaptive Lens |
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Athermalized Prime Lens |
F1.2:4.1mm/5.8mm/9.1mm/13mm |
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F1.0:19mm/25mm/35mm/55mm/75mm/100mm |
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Electric Focusing Lens |
Supported |
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Environment Adaptability |
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Operating Temperature |
-40°C~+80°C |
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Storage Temperature |
-45°C~+85°C |
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Humidity |
5%~95%, non-condensing |
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Vibration |
6.06g, random vibration, all axes |
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Impact |
80g, 4ms, final peak sawtooth wave, three axes, and six directions |
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